FR4 1.6MM AND 1.0MM H/H H/O B GRADE PLATE

Product Detail

brief introduction:

Rigid FR4 Sheets B grade, Copper Clad Laminate, Laminate Sheet manufacturer / supplier in China, Saling Copper Clad Laminate Sheet /Rigid PCB, Insulation Materials Epoxy G10 Fiberglass Sheet, Cheaper Price Fr4 Epoxy Laminated Sheet for LED & Speaker etc.

Basic Info




·         Model NO.: FR4 CCL B Grade

·         Solid Content: Fr4 CCL

·         Formation Methods: Copper Clad Laminate

·         Delivery: 7-10 Working Days

·         MOQ: 5 tons

·         Type: FR4Copper Clad Laminate Sheet

·         Material: Fiberglass+PP+Copper

·         Appliction: LED & Speaker

·         Customizable: Rigid PCB

·         Thermal Rating: H 180

·         Classification: Hybrid Insulation Materials

·         Color: Yellow

·         Origin: China

Product Description

Rigid PCB          FR4 Copper Clad Laminate  sheet  
           combines a woven glass fabric and an epoxy resin laminate (tg approximately 130°c) that contains bromine. The product provides consistent quality and good electrical properties under dry and humid conditions, as well as high flexural, impact, and bond strength at room temperatures. This product is suitable for a variety of structural, high humidity, and electrical insulation applications, which include terminal boards, lapping carriers.
 2.Specifications:
Thickness: 0.8mm,1.0mm,1.2mm,1.6mm
Thickness of copper:18um, 25um,35um. 
Copper: Single side (H/0) and double side (H/H)
Size: 1020mm*1220mm 
Features: 
1) The end face of foil covered board should be tidy without any delamination 
and crackle .
2) B grade will have small bubble, wrinkle, pin hole, deep nick, pitting and glue spot on the copper foil covered surface. Any color changing or dirty can be easily. removed by density 1.02g/cm3 hydrochloric acid or proper organic solution .
3. Applications:  Usually used in PCB of computers, home electric appliances and other lines.
 
FR4 CCL  /  Copper Clad Laminate    Technical Date:

FR4   TECHNICAL DATA SHEET
NO	ITEM		UNIT	INDEX
1	Surface   resistance after damp heat and recovery		MO	1.3x105
2	Volume   resistivity after damp heat and recovery		MO.m	1.63x106
3	Permittivity   after damp heat and recovery		/	Max: 5.5
4	Dissipation   factor after damp heat and recovery		/	0.017
5	Pulling   strength		N	Min: 60
6	Peel   strength after exposure to solvent vapour		N/mm	Min: 1.4
7	Blistering   after 10s heat shock		/	No   blistering or delamination
8	Solderability   (wetting test)		S	2
9	Flexural   strength		MPa	Min: 300
10	Flammability(vertical   burning test)		/	FV0 or FV1
11	Water   absorption		mg	Max:5.9
12	Measling		/	No   measling or blistering or delamination
13	Warpage	Bow	mm	Max: 18
		Twist		Max: 20














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